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Brand: Heidelberg Instruments
Category: Lithography Tools
Industry: Semiconductors, Material Science & Chemistry
The ultimate lithography research tool
The Heidelberg Instruments DWL 66+ Direct-Write Laser Lithography System is one of the most versatile and high-resolution maskless lithography systems available today. Designed for advanced research, prototyping, and microfabrication, the DWL 66+ enables scientists and engineers to create extremely precise microstructures without the need for physical photomasks.
This powerful system supports a wide range of applications including MEMS, microelectronics, microfluidics, photonics, sensors, optics, photovoltaics, material science, and quantum device research. By combining high-resolution patterning with advanced grayscale exposure capabilities, the DWL 66+ allows researchers to fabricate complex microstructures with exceptional accuracy and surface quality.
The system features Write Mode XR, delivering a minimum feature size of 200 nm, making it one of the highest-resolution direct-write laser lithography tools on the market. Its advanced grayscale lithography supports up to 65,536 exposure levels, enabling the creation of smooth 3D and high-aspect-ratio microstructures in thick photoresists.
Unlike traditional mask aligners, the DWL 66+ uses digital pattern data, allowing instant design modifications without the need for photomasks. This dramatically reduces development time, eliminates mask costs, and improves workflow efficiency for R&D laboratories and semiconductor development facilities.
The DWL 66+ also integrates industrial-grade stability technologies, including interferometric positioning control, real-time autofocus systems, and a controlled laminar airflow environment to maintain thermal stability and minimize contamination during exposures.
With its modular configuration, automated alignment options, and high-precision optics, the DWL 66+ provides a reliable solution for laboratories seeking high-quality microfabrication and fast prototyping.
Labindia Instruments Pvt. Ltd. is the authorised dealer in India for Heidelberg Instruments lithography systems, providing advanced microfabrication solutions for research institutions, semiconductor labs, and nanotechnology centers.
| Write Mode | XR | I | II | III | IV | V |
|---|---|---|---|---|---|---|
| Minimum Feature Size [μm] | 0.2 | 0.6 | 0.8 | 1 | 2 | 4 |
| Minimum Lines and Spaces [μm] | 0.3 | 0.8 | 1 | 1.5 | 3 | 5 |
| Address Grid [nm] | 5 | 10 | 25 | 50 | 100 | 200 |
| Edge Roughness [nm] | 50 | 50 | 70 | 80 | 110 | 160 |
| CD Uniformity [nm] | 60 | 70 | 80 | 130 | 250 | 400 |
| 2nd Layer Alignment over 5 x 5 mm² [nm] | 250 | 250 | 250 | 250 | 350 | 500 |
| 2nd Layer Alignment over 100 x 100 mm² [nm] | 500 | 500 | 500 | 500 | 800 | 1000 |
| Backside Alignment [nm] | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Write Speed [mm²/min] with Diode Laser (405 nm) | 3 | 13 | 40 | 150 | 600 | 2000 |
| Write Speed [mm²/min] with UV Diode Laser (375 nm) | 2 | 10 | 30 | 110 | - | - |
| Pixel Grid in x and y [nm] | 50 | 100 | 250 | 500 | 1000 | 2000 |
| Scan Speed [mm/s] | 1800 | 3600 | 4500 | 9000 | 18000 | 36000 |
| System Features | |
|---|---|
| Light Source | Diode laser with 405 nm or 375 nm |
| Substrate Sizes | Variable: 5 x 5 mm² to 9″ x 9″ | Customizable on request |
| Substrate Thickness | 0 to 12 mm |
| Maximum Exposure Area | 200 x 200 mm² |
| Environmental Chamber | Temperature stability ± 0.1°, ISO 4 environment |
| Real-Time Autofocus | Optical autofocus or air-gauge autofocus |
| Autofocus Compensation Range | 80 μm |
| Standard or Advanced Grayscale Mode | 128 or 32,768 gray levels respectively |
| Vector Mode | Enables the writing of stitching-free lines |
| Overview Camera | 13 x 10 mm² field of view facilitates alignment to marks and substrate navigation |
| Backside Alignment (optional) | Allows the alignment of exposures to structures on the backside of the substrate |
| Advanced Options - Performance Upgrades | |
| High-Accuracy Coordinate System | Includes golden plate calibration and climate monitoring: 2nd layer alignment over 100 x 100 mm² improved to 350 nm |
| Professional Grayscale Mode | 65,536 gray levels, professional data conversion software |
| Automatic Loading System | Handling of masks up to 7" and wafers up to 8" with two carrier stations, pre-aligner and wafer scanner |
| System Dimensions of Standard Version | |
| Width × depth × height | 1300 mm × 1100 mm × 1950 mm (lithography unit only) |
| Weight | 1000 kg (lithography unit only) |
| Installation requirements | |
| Electrical | 230 VAC ± 5 %, 50/60 Hz, 16 A |
| Compressed air | 6 - 10 bar |
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